Category | PCB Prototype Capability | Remark | |
Specification | Layers | 1-40 Layers | |
Board Thickness | 0.2mm-8.0mm | Thickness Tolerance: ± 10% ( t≥1.0mm) Thickness Tolerance: ±0.1mm (t<1.0mm) |
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Copper Thickness | 0.5oz-12oz | Min. trace w/s for 1 oz: 2.5mil/2.5mil Min. trace w/s for 2 oz: 5mil/5mil Others requirement please contact us |
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Base Materials | KB/ITEQ/Shengyi/Huazheng/Nelco/Isola/ CEM/Arlon/Rogers/Panasonic/Teflon/Polymide/Aluminum Base/Copper Base/Ceramics Base |
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TG Value | TG135-TG180 | ||
CTI Value | >CTT≥175V | ||
Max PCB Size | 600*1200mm | Base on your PCB design | |
Min PCB Size | 5*5mm | Base on your PCB design | |
Dimension Tolerance (Outline) | ±0.15mm | CNC routing and V-cut | |
Bow and Twist | ≤0.75% | ||
Etch tolerance | ±10% | ||
The distance from trace to outline | ≥10 mil | ||
Drilling and Hole | Min Drill Size | 0.15mm-6.0mm | |
Drill Aspect ratio | 10:1 | ||
PTH hole size tolerance | ± 3 mil | ||
NPTH hole size tolerance | ± 2 mil | ||
Hole position deviation: | ± 2 mil | ||
Hole to trace or pad spacing | min 6mil | ||
hole wall copper thickness | Hole to trace or pad spacing | ||
Hole to hole spacing | component hole ≥16mil | ||
via(≤0.45mm) ≥11mil | |||
Soldermask | Material | KSM / Taiyo | |
Color | green / blue/ yellow/ red/ black/ white/ Purple/ transparent/ etc | ||
Soldermask thickness | 0.4~1.0 mil | ||
Min soldermaks bridge | 4mil | ||
min PAD | 20 mil | ||
Silkcreen | Color | white/ black/ yellow/ red / etc | |
Min Character Width | 5 mil | ||
Min Character Height | 36 mil | ||
Surface treatment | Surface Finish | HASL, Immersion gold / sliver / tin, OSP, Hard Gold plating, Soft gold plating, NiPdAu |
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Gold thickness of ENIG | 1~ 6 u" | ||
Gold thickness of gold finger | 1 ~ 60u" | ||
Profiling | Tolerance of outline | ± 0.1mm | |
V-CUT Angle | 30 degree & 45 degree | ||
Depth V-CUT | Board thickness≧1.2 mm, remain thicknss: 1/3 | ||
Board thickness≦ 1.2 mm, remain thickness 20 mil (0.5 mm) | |||
Bevelling angle/depth | 20°/1.8 mm; 30° /1.0 mm; 45°/0.5 mm | Tolerance: ± 5°/± 0.2 mm |
Category | PCB Volume Production Capability | Remark | |
Specification | Layers | 1-20 Layers | |
Board Thickness | 0.2mm-6.0mm | ||
Copper Thickness | 0.5oz-10oz | min trace w/s for 1 OZ: 4 mil/4mil min trace w/s for 2 OZ: 6 mil/6mil Others need to check the Data |
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Base Materials | KB/ITEQ/Shengyi/Huazheng/Nelco/Isola/ CEM/Arlon/Rogers/Panasonic/Teflon/Polymide/Aluminum Base/Copper Base/Ceramics Base |
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TG Value | TG135-TG180 | ||
CTI Value | CTT≥175V | ||
Max PCB Size | 600*600mm | Base on your PCB design | |
Min PCB Size | 10*10mm | Base on your PCB design | |
Dimension Tolerance (Outline) | ±0.15mm | CNC routing and V-cut | |
Bow and Twist | ≤0.75% | ||
Etch tolerance | ±10% | ||
The distance from trace to outline | 10 mil | ||
Drilling and Hole | Min Drill Size | 0.2mm-6.0mm | |
Drill Aspect ratio | 10:01:00 | ||
PTH hole size tolerance | ± 3 mil | ||
NPTH hole size tolerance | ± 2 mil | ||
Hole position deviation: | ± 2 mil | ||
Hole to trace or pad spacing | min 6mil | ||
hole wall copper thickness | 18-25 µm | ||
Hole to hole spacing | component hole ≥16mil | ||
via(≤0.45mm) ≥11mil | |||
Soldermask | Material | KSM / Taiyo | |
Color | green / blue/ yellow/ red/ black/ white/ Purple/ transparent/ etc | ||
Soldermask thickness | 0.4~1.0 mil | ||
Min soldermaks bridge | 4mil | ||
min PAD | 20 mil | ||
Silkcreen | Color | white/ black/ yellow/ red / etc | |
Min Character Width | 5 mil | ||
Min Character Height | 36 mil | ||
Surface treatment | Surface Finish | HASL, Immersion gold / sliver / tin, OSP, Hard Gold plating, Soft gold plating, NiPdAu | |
Gold thickness of ENIG | 1~ 5 u" | ||
Gold thickness of gold finger | 1 ~ 15u" | ||
Profiling | Tolerance of outline | ± 0.1mm | |
V-CUT Angle | 30 degree & 45 degree | ||
Depth V-CUT | Board thickness≧1.2 mm, remain thicknss: 1/3 | ||
Board thickness≦ 1.2 mm, remain thickness 20 mil (0.5 mm) | |||
Bevelling angle/depth | 20°/1.8 mm; 30° /1.0 mm; 45°/0.5 mm | Tolerance: ± 5°/± 0.2 mm |
Sheets Cutting
Exposure Machine
Etching Line
Drilling Machine
PTH Line
Solder Mask Exposure
BGA Rework Machine
Automatic Optical Inspection
PCB Appearance Inspection Machine
Flying Probe Tester
E-Tester
Immersion Gold Line